Semiconductor Packaging Materials Electronic Packaging Materials

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Supremetec Materials Co.,Ltd

02-2758-0920, 03-537-5370

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Semiconductor Packaging Materials Electronic Packaging Materials


company	Supremetec Materials Co.,Ltd
Categories	Electronics Packaging
Update	2011-03-15
Original Region	China
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Semiconductor Packaging Materials Electronic Packaging Materials

Hysol Electronic Molding Compounds protect
passive components, such as ceramic and tantalum
capacitors and resistors, and are designed for both
automolds and conventional molds.
Our unique gold compounds are ideal for high
contrast laser marking and are available in fast cure
versions for high productivity. You can also choose
from cutting-edge low stress compounds, capable of
thin wall designs for today’s relentless demands to
miniaturize every component.
New generation molding powders have been
designed to meet electronics industry’s need for
plastics that are environmentally friendly and
resistant to cracking after 260°C IR reflow. New
blends of proprietary flame retardants are used to
replace the traditional antimony oxide/halogenated
resin flame-out systems. The materials are a new
family that pass UL standards and meet the EU’s
environmental requirements (i.e., no halogens,
no heavy metals). Combining these new flame
retardants with new resin technology and filler
blends has produced a series of ultra low stress
materials that resist cracking after exposure to
260°C IR reflow conditions.

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