Electronics Assembly Materials COB Encapsulants
Encapsulants are used to provide environmental
protection and add mechanical strength to
wire bonded devices. Two different application
technologies are employed for the protective
encapsulation of wire bonded die:
Glob top technology requires an encapsulant with
a fine-tuned rheology, as the flow capabilities
must allow the wires to be covered without the
encapsulant flowing beyond the chip.
Dam and fill technology, where the dam is used
to limit the flow of the low viscosity fill material,
allowing its use with fine pitch wire leads.
Henkel’s Hysol and Eccobond encapsulants
are available as either thermal or ultraviolet cure
materials and are designed for the highest reliability
in that they offer low coefficient of thermal
expansion, high glass transition temperature, and
low ionic content. These encapsulants have been
engineered to provide protection to wire bonds,
leads, aluminium and silicon dies from harsh
environments, mechanical damage and corrosion.
Formulated from epoxy, polyurethane, acrylate (UV
curable) and silicone chemistries, these systems have
proven reliability for electronic insulation. Henkel
encapsulants offer excellent elevated temperature
stability and thermal shock resistance, outstanding
electrical insulation at both room and elevated
temperatures, minimal shrinkage and low stress
during cure, as well as excellent chemical resistance.
Our encapsulants have been designed to offer high
throughput and low-cost assembly processes.
